CAPRES A/S IMEC Joint development Program using microRSP M300 microscopic four point probing tool for sub 32nm processes monitoring
Lyngby, Danemark (IBwire.com - May 06, 2009) - CAPRES A/S is very pleased to announce the start of a Joint Development Program (IMEC-CAPRES) on the assessment of micro-probe technology for advanced semiconductor applications.
This program originates from earlier interactions between CAPRES A/S and IMEC and a more intense collaboration within EU supported program PULLNANO (launched mid 2006) where one of the objective was to realize research on the materials, devices, architectures, interconnects modelling and characterization to prepare the future 22nm node. CAPRES A/S contribution was mostly toward the full characterisation of Ultra Shallow Junction (USJ) used in these advanced nodes.
The work within PULLNANO demonstrated the unique capabilities of the microRSP technique to characterise the sheet resistance of ultimate USJ down to 10nm and fine scale wafer (non)-uniformities as observed in advanced annealing concepts (flash, laser, spike anneal).
The present program targets new approaches to process monitoring by focusing on the on- product capabilities of the technique and on the information provided by the high spatial resolution of the technique, as well as on the characterization of USJ’s in Ge, III-V, II-VI substrate materials. The workprogram is facilitated by the recent successful installation at IMEC of the microRSP M300, the latest microscopic four point probes platform of CAPRES A/S.
Peter Former Nielsen, VP, Director Development and Application, CAPRES A/S, stated that by the acquisition of the microRSP platform, IMEC showed its willing to bring the technique beyond the USJ electrical characterisation and that it can be intensively used in SiGe, III-V, II-VI based semiconductor devices as well as on specific annealed films where the annealing uniformity is a key parameter to control at micrometer scale.
Wilfried Vandervorst, IMEC Fellow and Department Head Materials and Components Analysis stated that the present program reflects the confirmation of our interests in the microprobe probe concept and confirms a long term collaboration on USJ metrology between CAPRES A/S and IMEC, The installation of the microRSP M300 strengthens this partnership and represents a unique opportunity to explore in-line USJ metrology and optimization of advanced annealing concepts.
About CAPRES A/S:
CAPRES A/S is a Danish company established in 1999 on the idea of using micro and nanoscopic multi-cantilever probes to measure resistivity on thin conducting and semi-conducting layers.
CAPRES has been successful in implementing revolutionary fast turn around CIPTech platform allowing measuring sheet resistance, RA and Magneto resistance on MTJ based devices based on 12 point probes. They are routinely used in the read head, hard disk and MRAM industry. Leader on that market, CAPRES A/S launched in 2007 a development program aiming at developing a specific platform, the microRSP for conducting and semiconducting layers characterization using microscopic 4 point probes. The unique features of the technique allow non destructive, direct and unrivalled reproducible measurement of sheet resistance with probe size down to 20µm. That makes the technique of choice for the next generation node in the device manufacturing where very thin doped layer are used and cannot be measured using conventional or non contact probing techniques.
Further information on CAPRES A/S can be found on www.capres.com.
IMEC is a world-leading independent research center in nanoelectronics and nanotechnology. IMEC vzw is headquartered in Leuven, Belgium, has a sister company in the Netherlands, IMEC-NL, offices in the US, China and Taiwan, and representatives in Japan. Its staff of more than 1650 people includes more than 550 industrial residents and guest researchers. In 2008, its revenue (P&L) was estimated to EUR 270 million.
IMEC’s More Moore research aims at semiconductor scaling towards sub-32nm nodes. With its More than Moore research, IMEC looks into technologies for nomadic embedded systems, wireless autonomous transducer solutions, biomedical electronics, photovoltaics, organic electronics and GaN power electronics.
IMEC’s research bridges the gap between fundamental research at universities and technology development in industry. Its unique balance of processing and system know-how, intellectual property portfolio, state-of-the-art infrastructure and its strong network worldwide position IMEC as a key partner for shaping technologies for future systems.
Further information on IMEC can be found on www.imec.be .
Email : email@example.com
Website : www.capres.com
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